国家/地区 中国（8）
IPC部 B（8）
IPC大类 B32（8）
IPC小类 B32B（8）
IPC B32B037/06（7） B32B037/10（7） C23C016/26（6）
B32B015/20（5） C23C016/56（4） B32B009/00（3）
B32B009/04（3） B32B015/01（3） B32B033/00（3）
C01B032/186（3） C01B032/194（3） B32B038/00（2）
发明人 DUAN Y（3） SHAO L（3） SHI H（3）
CHEN Q（2） GONG M（2） HUANG D（2）
LI X（2） LI Y（2） LI Z（2）
LIANG J（2） LIU B（2） PEI Z（2）
WANG Y（2） YANG W（2） ZHANG X（2）
公开年 2022（8）
申请年 2022（6）  2021（2） 
专利权人 CHINESE ACAD.（3） CHONGQING GR.（3） CRRC IND RES.（2）

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z

Scale production device of high conductive graphene metal composite material, has sealing chamber that is provided with feeding area and high temperature area provided with heating mechanism, pressing mechanism and transport mechanism.

SHAO L, DUAN Y, SHI H, LI Z, ZHANG Y

Metal-graphene laminated composite plate comprises metal layer and graphene layer alternately arranged.

SHAO L, HUANG D, DUAN Y, JIANG H, XU X, YU J, MA J, SHI H, LI X

Preparing graphene copper composite material useful in supercapacitors and motor drive devices, comprises e.g. pre-setting multi-layer copper foil in hot pressing chamber, adopting chemical vapor deposition, preparing graphene film on copper foil surface, and sintering graphene-copper.

GONG M, ZHAO M, LI M, CHEN C, CHEN Q, YANG W, LI Y, WANG Y, LIU B, PEI Z, ZHANG X, LIANG J

Method for manufacturing corrosion resistant aluminum brazing composite plate for use in automobile, involves performing hot rolling, primary annealing, cold rolling, secondary anneal and cooling to obtain corrosion-proof aluminum brazing composite plate.

DING D, DING X

Preparation device of metal layered graphene on solid carbon source, has heat compression chamber that is provided with auxiliary gas path mechanism introducing auxiliary gas into sample chamber, growth chamber and compression chamber.

SHAO L, LI X, ZHANG Y, LI Z, HUANG D, SHI H, DUAN Y

Composite structure heat conducting plate for use in electronic chip industry, has m metal layers and n graphite layers, where m metal layers and n graphite layers are alternately arranged and assembled by vacuum diffusion bonding process.

HU T, NIU T, GUO S, CHEN X

Composite material used for improving electroconductivity of metal, has graphene fragment layer that comprises graphene fragments uniformly spread on metal foil layer.

GONG M, SUN B, WANG Y, CHEN Q, YANG W, LI Y, LIANG J, LIU B, ZHANG X, PEI Z