国家/地区 中国（5） 巴西（2）
IPC部 B（7）
IPC大类 B32（7）
IPC小类 B32B（7）
IPC F41H005/04（7）
发明人 COSTA U O（2） DAI S（2） MONTEIRO S N（2）
PEREIRA A C（2）
公开年 2022（2） 2023（2）
申请年 2020（2）  2022（2） 
专利权人 AVIC BEIJING.（2） COSTA U O（2） MONTEIRO S N（2） PEREIRA A C（2）

Nano-filler reinforcing fiber hybrid structure ballistic resistant composite material formed by paving first prepreg (nano filler modified fiber prepreg) obtained by soaking reinforcing fiber in modified aqueous polyurethane and second prepreg (weft-free cloth) obtained by soaking reinforcing fiber.

QI C, SONG L, SHANG B, ZHAO Y, GUO M

Foam electromagnetic shielding material with bulletproof function used in stealth airplanes, is prepared by superposing coated aramid fiber laid fabric blocks to obtain bulletproof aramid fiber chips to obtain foam electromagnetic shielding material precursor, and heating.

FU L, PAN Z, WU Z, LIU Y, FANG X, CUI Z, LI Z, XU D, AI Q, HU L, LI N, CHEN H

Composite plate used for forming multilayer composite shielding system used as ballistic armor layer in personal vest for protection against firing of rifle with caliber ammunition, and in military vehicles, comprises natural fiber reinforced thermoset polymer.

MONTEIRO S N, COSTA U O, PEREIRA A C

Composite material used for multilayer armor, comprises thermoset polymer reinforced with natural fiber.

MONTEIRO S N, COSTA U O, PEREIRA A C

Lightweight armor subassembly module comprises assembly module arranged according to bullet-facing surface sequence, polymer-reinforced graphene functional filler, and ultrahigh-strength alloy steel bullet-facing plate.

HUO X, ZHANG Z, GUO S, ZHAO L, CHENG L, GENG L

Protective plate comprises front and back panels, where panels are bonded graphene ceramic protective structure and balance is binder.

DAI S, WANG S, WANG X, WU Y, LI J

Graphene/metal composite material preparation method, involves adding polyethylene alcohol to distilled water to obtain mixture solution, filling polyethylene alcohol and distilled water in cell, and connecting metal plate with block.

YANG C, LIU D, DAI S, HONG Q, LIN Z, YAN S