国家/地区 美国（6） 世界知识产权组织（6） 中国（4） 欧洲专利局（EPO）（3） 日本（3） 韩国（3） 台湾（2）
IPC部 B（7）
IPC大类 B32（7） C01（4） F28（4）
H01（4） H05（3） B05（2）
B82（2） C09（2） F16（2）
IPC小类 B32B（7）
IPC B32B009/00（5） F28F021/02（4） B32B007/12（3）
B32B015/04（3） C01B031/04（3） H01L023/373（3）
H05K007/20（3） B05D001/02（2） B32B007/02（2）
B32B009/04（2） B32B037/06（2） B32B037/10（2）
B32B037/12（2） B32B037/24（2） B82Y030/00（2）
发明人
公开年 2014（7）
申请年 2013（3）  2012（2）  2014（2） 
专利权人

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Method for manufacturing radiant heat sheet of heat dissipation device, involves forming composite dispersed solution in inner side of adhesive part, where heat dissipation films are made of graphene and carbon nanotube.

PARK Y S, PARK Y

Graphene/metal composite material preparation method, involves adding polyethylene alcohol to distilled water to obtain mixture solution, filling polyethylene alcohol and distilled water in cell, and connecting metal plate with block.

YANG C, LIU D, DAI S, HONG Q, LIN Z, YAN S

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K

Thermal management assembly for transferring heat away from heat source, comprises first substrate, second substrate, bulk graphene material disposed between first and second substrates, and thermal bond layer.

FAN W, LIU X, MARINER J, RAPE A

Tubular graphene laminate used for, e.g. pipes, consists of graphene film to which carbon is covalently bonded, formed in tubular shape by being arranged along inner surface side or outer surface side of tubular support layer.

HASEGAWA SHOJI

Method for forming graphene on substrate used in mechanical system, involves forming solution processed graphene on substrate so as to establish low friction wear surface.

SUMANT A V, ERDEMIR A, CHOI J, BERMAN D