国家/地区 中国（8）
IPC部 B（8） C（4） H（2）
IPC大类 B32（8） C08（4） B65（2）
IPC小类 B32B（8）
IPC B32B007/12（3） C08K003/04（3） B32B009/00（2）
B32B009/04（2） B32B027/08（2） B32B027/30（2）
B32B027/32（2） B32B033/00（2） B32B038/00（2）
B65D065/40（2） C08K003/22（2）
发明人 ZHANG C（8）
公开年 2021（4） 2022（4）
申请年 2021（8）
专利权人 GAOFAN ZHEJI.（2）

Extensible insulating plastic film used for packaging, comprises film main body, where inner portion of film main portion is provided with vent hole, and outermost layer of main portion provided with hydrophobic layer.

ZHANG C

Processing technology of medicinal composite film based on temperature-sensitive technology comprises e.g. coating adhesive on one side of polyester film layer to form first adhesive layer, compounding polyvinylidene chloride film layer with first adhesive layer, and curing.

ZHOU S, ZHANG C, GU S

Graphene antibacterial fabric useful for down jacket, comprises outer layer blended with outer layer fiber and graphene antibacterial fiber, middle layer formed by mixing graphene antibacterial fiber and fabric adhesive, and inner layer blended by inner layer fiber and graphene antibacterial fiber.

LIU H, LI W, ZHANG C, WU K, CHEN Y

Material useful in preparing pipe for underground coal mine, comprises polyvinyl chloride resin, impact modifier, antistatic agent, flame retardant smoke inhibitor, lubricant, heat stabilizer, reinforcing agent and plasticizer.

LI F, FENG J, LI N, MA J, ZHANG C

Anti-radiation metal fibre fabric to mobile phone, computer, printer, household microwave oven, electric blanket and blower, comprises a base cloth layer, radiation-proof resin layer and functional layer from inside to outside.

ZHANG C, WU K, CHEN Y, WU K M, ZHANG Y G, LI W

Epoxy-type copper-clad plate material useful for aluminum substrate, and copper clad laminate, comprises composite resin, accelerator, curing agent and tin dioxide/graphene.

ZHANG C

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Preparation method for organic silicon or graphene thermal interface material, involves coating layer of adhesive on side of graphite film, and obtaining stacked structure organic silicon or graphene thermal interface material.

YE Z, ZENG X, LI J, ZHANG C, ZHANG Y, XU J, SUN R