国家/地区 中国（23） 美国（3） 世界知识产权组织（3） 韩国（2）
IPC部 C（26） B（5） H（4）
F（2）
IPC大类 C01（26） C09（26） C08（4）
C23（4） B01（3） H01（3）
H05（3）
IPC小类 C01B（26）
IPC C09K005/14（26）
发明人 LIU X（3） CAI J（2） CAO H（2）
CHENG W（2） DUAN C（2） GAO G（2）
HAO Z（2） LI L（2） LIANG W（2）
LIU J（2） SHENG Y（2） WANG H（2）
WANG S（2） WANG W（2） WANG Z（2）
公开年 2022（14） 2021（10） 2023（2）
申请年 2021（26）
专利权人 CHN ENERGY I.（2） GUANGDONG MO.（2） NAT INST CLE.（2） TAIXING ZHIF.（2）

Preparing ultra-high elastic polyimide fiber/graphene composite gas gel comprises e.g. dispersing polyimide chopped fiber in alkali solution, performing surface modification, mixing graphene solution dispersion liquid with polyimide chopped fiber, dialyzing, freezing and drying.

FENG Y, YIN W, FENG W

Use of nitrogen-doped graphene metal material in heat-conducting field where nitrogen-doped metal graphene comprises metal base material and nitrogen-doped graphene.

WU Q, MA Y

Producing graphene composite film useful in heat dissipation material for ultra-large-scale consumer electronics, comprises vacuum pressing an expanded graphite powder and a graphene film to obtain the graphene composite film.

ZHOU Y, LIU X, WANG W, LI L, CHENG W

Heat accumulation of carbon material with z-plane orientation degree and high degree of graphitization and specific degree of overall orientation, prepared by mixing thermally conductive fillers, agglomerant and high thermally conductive additives, and pressing and molding.

ZHANG H, YU D, WEI J, SHENG Y, GAO G, ZHENG D, LIANG W, LIU J, DUAN C

High-strength heat accumulation carbon material useful in heat accumulation and/or heat dissipation field, prepared by mixing components in high-strength heat storage carbon material composition, molding, sintering or graphitizing molding material in inert atmosphere.

ZHANG H, YU D, WEI J, GAO G, ZHENG D, SHENG Y, LIANG W, LIU J, DUAN C

Surface modified hexagonal boron nitride particles used for thermally conductive resin composition, have partially reduced graphene oxide adsorption layer on surface of untreated hexagonal boron nitride particle.

ZAIMA H, SUGIMORI S, ONAKA J, ITO G

Electromagnetic interference (EMI) shielding device has dielectric layer and layer of fillers that have volume overlapped with each other when carbon-based materials are self-aligned in presence of magnetic field.

LIU C, LI W C, CHEN X, KWOK C H, LI W, GUO Z

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Graphitizing graphene thermal conductive film comprises e.g. placing graphene thermal conductive film with graphite paper clamped on both sides on graphite shaft, covering graphite crucible with cover to form thermally conductive film graphitized assembly, and installing graphitization assemblies.

DANG J, XU Y, ZHANG J, CAO H, WANG S, ZHANG X, LI D, YANG J, LIANG R, YUAN Q, WU F

Preparing nitrogen-doped graphene noble metal composite film, comprises coating mixture made of graphene oxide solution, water-soluble noble metal compound and water-soluble amine cross-linking agent e.g ethylenediamine, drying film, and heating under the protection of inert gas.

CHENG J, LI Y, ZHANG P, AN X