国家/地区 美国（5）
IPC部 B（5）
IPC大类 C01（5） C25（5） B32（4）
B82（2）
IPC小类 C01B（5）
IPC C01B031/04（5）
发明人 GUO L（2） HAN S（2） LI X（2）
公开年 2013（2） 2014（2）
申请年 2012（5）
专利权人 INT BUSINESS.（2）

Electrochemical etching method for removing metal substrate layer from graphene layer, involves connecting graphene layer or metal substrate layer to power source to supply current to etch metal substrate layer from graphene layer.

HAN S, GUO L, LI X

Apparatus for electrochemical or electroplating etching of copper foils from graphene for e.g. electronic device application, has anode including metal substrate layer etched from graphene layer in response to current flowing through anode.

HAN S, GUO L, LI X

Method for transferring graphene on substrate used in electronic device, involves depositing graphene on side of metal substrate, and stacking target substrate on metal substrate-graphene layer to form stacked structure.

GONG K

Removing graphene film grown on surface of metal substrate, comprises applying support layer to exposed surface of graphene film to define first structure, and subjecting first structure to electrochemical process to form gas bubbles.

LOH K P, WANG Y, LOH K

Method for non-destructively transferring graphene, involves nondestructively combining graphene coated with media with target substrate, and removing media to transfer graphene to target substrate nondestructively.

REN W, GAO L, MA L, CHENG H