国家/地区 美国（5） 欧洲专利局（EPO）（4） 世界知识产权组织（4） 中国（3）
IPC部 C（7）
IPC大类 C01（7）
IPC小类 C01B（7）
IPC C01B032/186（7）
发明人
公开年 2016（3） 2022（2）
申请年 2015（3）  2021（2） 
专利权人

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Visualizing distribution and intrinsic orientation of periodically spaced one-dimensional structures by depositing electrically conductive solid film of imaging material onto surface of two-dimensional material, providing polarization microscope, and imaging layered composite at acquisition angles.

AMADO E, KRESSLER J

Preparation of graphene flexile bendable screen involves depositing organic film layer on rigid substrate, depositing graphene film layer and peeling organic film layer.

REN G, MA L, LIU S

Electrical conductor for use in electronic devices, has first conductive layer that includes graphene which is p-doped with p-type dopant, formed in first surface facing second conductive layer and second surface.

SOHN H, SHIN W, WOO Y S, SUN X, XIN Y, YEO R, SOHN H S

Synthesizing graphene involves annealing substrate in hydrogen gas atmosphere, subsequently undertaking deposition and nucleation step where relatively thick carbon layer is deposited onto substrate, and undertaking graphene growth step.

BOINTON T H, BARNES M D, RUSSO S, CRACIUN M, HARDISTY BOINTON T

Forming a graphene device, used to form sensor device, comprises forming a graphene film over a substrate, depositing a polymer material covering a surface of the film, by gas phase deposition, and removing the substrate from the film.

KALITA D, BOUCHIAT V, MARTY L, BENDIAB N

Method for preparing graphene conductive film for flexible touch device, involves growing graphene layer on metal-catalyzed base, and coating polyamic acid solution layer on graphene layer, where polyimide film is formed by thermal curing.

DI Y