国家/地区 中国（8） 美国（3） 世界知识产权组织（3） 日本（2） 韩国（2）
IPC部 C（8）
IPC大类 C04（8）
IPC小类 C04B（8）
IPC C04B035/622（8）
发明人 LIN Y（2）
公开年 2021（8）
申请年 2021（4）  2019（2）  2020（2） 
专利权人

Terahertz source emitting material used for forming terahertz emitter for bed article, comprises quartz powder, graphite powder, tin powder, aluminum oxide, and magnesium oxide having preset particle size.

ZHANG J

Preparing compact flexible graphene/polystyrene composite heat conducting film involves drying graphene oxide powder, sieving, grinding graphene oxide powder, styrene and zirconium ball, and coating graphene oxide styrene dispersion liquid.

WANG W, SONG X, LIU T, XU X, MA L, XU R, HOU S

Preparing flexible graphite grounding conductor material comprises e.g. mixing resin, carbon forming agent, conductive material, stirring to form carbon resin, impregnating carbon material with carbon-forming resin, paving, stacking tape.

FAN M, HE H, TAN B, WANG X, TONG X, DAI M, LI Z

Use of silicon carbide whisker modified with fluorosilane coupling agent oligomer, for improving thermal conductivity of silicon carbide ceramic plate used for substrates of high-brightness LED light source.

ZHANG X, LING J, PAN T, BAI W

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Continuous electrophoretic deposition modified carbon fiber reinforced multi-matrix composite material comprises carbon fiber, inorganic powder including graphene powder, aluminum oxide powder and/or zirconium oxide powder, and substrate.

CHEN Z, LIAO J

Preparing bending-resistant composite radiating film comprises e.g. taking graphite oxide aqueous solution, firstly adding radiating filler, stirring uniformly, then adding emulsifier and stirring until emulsifier is completely dissolved.

LIN Y, LI X, ZHANG Y, YANG X

Graphite sheet useful for electronic device, has thermal conductivity in plane direction, and thermal conductivity in thickness direction.

KIM K S, WON D Y, CHOI J Y, CUI Z, YUAN D, JIN J