国家/地区 中国（7）
IPC部 C（7） B（2） E（2）
IPC大类 C04（7） E04（2）
IPC小类 C04B（7）
IPC C04B038/08（7）
发明人
公开年 2022（7）
申请年 2022（5）  2021（2） 
专利权人

Preparing hollow silicon carbide micro-bead used for preparing bullet-proof armor involves mixing layered graphene with silica sol, adding ethanol aqueous solution, adding aqueous ammonia, crushing fine particle gas gel, processing, carbonizing, mixing silicon powder with micro beads and sintering.

SHI K, WANG J, LUO J

Environment-friendly fly ash heat insulating material use in a building comprises sodium silicate, sepiolite powder, fly ash, organic-inorganic composite material, titanium pigment, talcum powder, vermiculite, hollow glass micro-bead and organosilicone hydrophobic agent.

ZHANG J

Lightweight fire-resistant nano-building material, comprises fire-proof material, light calcium carbonate, glass bead, diatomite, hydroxypropyl methylcellulose, bisphenol A epoxy resin, isopropyl titanate triisostearate, nano titanium dioxide, and water.

JIANG Y, HUANG Z, CHEN X, HUANG Q

Graphene paper composite filler conductive mortar useful e.g. in building material comprises cement, fly ash, middle sand, graphene paper composite material, re-dispersible latex powder, water reducing agent, retarder, and antifoaming agent.

LIN Z, HUANG B, HUANG N, WANG P, ZHANG X, ZHANG W

Method for preparing graphene gas gel heat preservation non-burning plate, involves adding graphene oxide gas gel powder and graphene powder into dispersing kettle, using purified water as medium, fully dispersing, and putting dispersion liquid.

PENG X, LIU D

Fireproof flame retardant macromolecule light building outer wall insulating composite plate useful in building industry, comprises e.g. inorganic material, common silicate cement, heat absorbing agent, waste material, silicon-based nano-powder, heat-absorbing agent, additive and water.

REN J, WANG Y, HOU Y

Wave-absorbing material useful in building including residential building, commercial building, office building and an industrial building, has surface layer that is impedance matching layer and bottom layer is absorbing layer.

FANG W, BAI C, ZHU Y, YANG T, YUE L, DENG G, YANG Y