国家/地区 中国（4） 日本（2） 世界知识产权组织（2）
IPC部 C（5）
IPC大类 C04（5） B23（2） C01（2）
H01（2）
IPC小类 C04B（5）
IPC C04B037/02（5）
发明人 LIU X（2） YANG K（2） YU X（2）
公开年 2021（3） 2022（2）
申请年 2021（5）
专利权人 MITSUBISHI M.（2） NANTONG WINS.（2）

Improving warping of copper-clad ceramic substrate motherboard comprises ball-milling and drying modified hollow glass microbead with ethanol and microfiber, mixing composite hollow glass microbead with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, electroplating and etching.

LIU X, YANG K, YU X

Preparation of aluminum nitride copper-clad ceramic substrate for semiconductor refrigerator, involves preparing aluminum nitride ceramic substrate, pretreating ceramic substrate, coating solder on ceramic slurry on two sides of pretreated ceramic substrate, and cleaning copper foil.

YANG K, LIU X, YU X

Indirect braze welding of aluminum nitride ceramic copper-clad plate by depositing active metal elements on surface of pretreated ceramic substrate, and applying composite solder on surface ceramic substrate.

ZHU W, TANG M, RAN X

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N