国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08G083/00（3） C08L087/00（3） C08K003/04（2）
发明人 ZHANG W（7）
公开年 2022（5） 2023（2）
申请年 2022（7）
专利权人

Rapid preparation of supramolecular cyclodextrin metal-organic framework and graphene composite used in adsorption treatment of organic dyes, by dissolving cyclodextrin, potassium hydroxide and nucleating agent graphene in deionized water, allowing to stand, washing with methanol, and drying.

XIA T, LI X, ZHENG Z, ZHANG W

Preparing graphene composite antistatic biodegradable polylactic acid plastic, comprises e.g. preparing polycaprolactone grafted hyperbranched polyethylene and graphene dispersion, adding graphene dispersion into polylactic acid particles dissolved in organic solvent, casting, removing the solvent.

XU L, YE H, TAO Y, ZHANG W, XU K

Aqueous novolac epoxy static conductive coating for long-acting protection, comprises e.g. aqueous phenolic epoxy emulsion, silver-coated aluminum powder, film-forming auxiliary agent, silane coupling agent and rheology auxiliary agent.

ZHANG W, QIAN C

Preparing weather-resistant nylon composite material used in manufacturing fishing nets, involves polymerizing adipic acid, hexamethylene diamine and 1,5-pentamethylenetetetrahydro-1,5,5-(pentamethylamine), and mixing with nano-zirconium oxide and graphene to obtain filler.

ZHANG W, HAN H, LING G

Preparing a composite anode material for a biocompatible microbial fuel cell, involves adding aniline to toluene, and stirring in an ice-water bath, adding polyvinyl alcohol aqueous solution into hydrochloric acid solution, then stirring hydrochloric acid solution containing polyvinyl alcohol.

CHEN L, PANG S, ZHANG W, ZHU P, LI X

High flame retardant ultra-low density foam absorbing material comprises silane-modified hollow glass beads, oxygen-containing graphene modified organic silicon resin, and catalyst.

ZHANG X, ZHANG W

Preparing graphene oxide/epoxy resin composite material modified by chitosan-polyethylene glycol diglycidyl ether used in e.g. aerospace, military industry, and electronic packaging, comprises dissolving chitosan powder in acetic acid solution and stirring, heating and curing.

MA R, SONG Y, ZHU S, ZHANG W, MA L