国家/地区 中国（5）
IPC部 B（5）
IPC大类 C08（5） B32（4）
IPC小类 C08G（5）
IPC C08K007/14（5）
发明人
公开年 2022（4）
申请年 2022（5）
专利权人

Low dielectric composition useful in laminated plate of printed circuit board, comprises epoxy resin, hardener comprising flame retardant hardener and benzoxazine resin, halogen free flame retardant, accelerator, additive comprising inorganic filler, toughening agent and solvent.

YAO J, GONG J, CHEN S, TANG F

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

High hardness polyurethane tire useful in forklift tire for fork wheel, comprises curing agent comprising dispersion of complex of small molecular diamine and sodium chloride in dioctyl adipate and isocyanate prepolymer composed of diisocyanate and polyether polyol.

WANG J, LI F