国家/地区 中国（2） 韩国（2） 台湾（2） 世界知识产权组织（2）
IPC部 C（4） H（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08K003/04（4）
发明人
公开年 2022（2）
申请年 2021（2） 
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Automatic temperature-limiting heating cloth comprises temperature-limited heating wire, electrode connecting belts, and laminating film layer, where electrode connecting belt are connected with positive and negative electrodes of power supply.

PENG Y, SHAO M

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q