国家/地区 中国（6）
IPC部 C（6） H（6）
IPC大类 C08（6）
IPC小类 C08G（6）
IPC C08L079/08（6）
发明人 ZHANG B（2） ZOU H（2）
公开年 2019（2） 2022（2）
申请年 2019（2） 
专利权人

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Preparing ultra-light polyurethane imide material porous comprises e.g. adding pyromellitic dianhydride and methanol to dimethylformamide to dissolve, adding conductive carbon material castor oil, ionic water, silicone oil, tertiary amine catalyst and organic tin catalyst and stirring.

WU Q, SHI R, LI C, QIN L, ZOU H, LV X, YAO A, SHU Q

Preparing composite aerogel for preparing conductive material, by adding polyamide acid and graphene to deionized water, adding organic amine, pouring to mold, placing in freezing medium, freeze-drying and performing thermal imidization.

LIU P, YU Z, CHEN S, YUAN S, ZOU H

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Composite film comprises substrate film composed of graphene, high molecular polymer, curing agent and coating layer.

SUN R, YE H, ZHAO T, ZHANG B, HU Y, LIANG X

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN