国家/地区 中国（6）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08G（8）
IPC C08J005/18（8）
发明人
公开年 2022（8）
申请年 2021（8）
专利权人

Manufacturing heat dissipation sheet e.g. for light-emitting diode lighting lamp comprises e.g. mixing heat dissipation sheet main raw material of conductor powder and additives in bind composed of liquid nitrile rubber-modified epoxy resin.

BAEK L J

Composition for forming molded product, three-dimensionally-printed product, and blended polymer product, comprises poly(aryl ether ketone) (PAEK) having carbon-based nanomaterial dispersed within.

FENG S, LIU C, SUE H

Polyurethane thermoplastic polyurethane curtain inner lining comprises polytetrahydrofuran ether diol, butanediol, diphenylmethane diisocyanate, dibutyltin dilaurate, calcium carbonate, silicate, and carbon black and dispersant i.e. polyvinylpyrrolidone.

ZHANG W

Preparation of polyimide film for high-frequency communication electronic equipments, involves polymerizing aminated graphene quantum dot powder, diamine monomer and dicarboxylic anhydride monomer, adding pore-foaming agent, casting, stretching, performing thermal imidization treatment.

SUN S, PAN C, FANG C, SU J

Graphene-polyimide (PI) film useful in electronic field comprises 4,4'-Oxydiphthalic anhydride, 4,4'-diaminodiphenyl ether, modifier, filler and binder.

SHI L, ZHU Q, ZHENG Z

Polyimide material used for aerospace comprises phosphorus containing polyimide resin, silicon containing anti atomic oxygen filler and conductive filler.

ZHI X, LV F, LIU J, ZHANG Y

Preparing high heat-conducting polyimide film useful in flexible heater comprises e.g. pouring graphene oxide into mixed solution of aromatic diamine, biphenyl dianhydride and dimethylacetamide solution to obtain polyamic acid solution, heating polyamic acid solid film, and forming film.

LI L, CHEN J, TANG X, XU Y

Polyimide antistatic film comprises polyimide and antistatic agent, polyimide antistatic film prepared by adding polyimide and antistatic agent into organic solvent, dissolving, mixing uniformly, coating, forming film, removing solvent.

JIN W, LIU G, HU T