国家/地区 日本（6）
IPC部 B（6） C（6） H（4）
IPC大类 B32（6）
IPC小类 B32B（6）
IPC C08K003/04（5） C08J003/20（3） B05D005/12（2）
B05D007/24（2） B32B027/00（2） C08K007/06（2）
C08K009/04（2） C08L071/00（2） C08L101/00（2）
C08L101/12（2）
发明人
公开年 2021（3）
申请年 2021（2） 
专利权人

Conductive powder used for forming coating material for forming electrode, comprises conductive polymer powder containing (pi)-conjugated conductive polymer and polyanion, and graphene.

MATSUBAYASHI S, TAKEZAWA Y

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L

Method for forming high-strength graphene-reinforced polymer matrix composite for e.g. aircraft part for commercial application, involves applying succession of shear strain events to molten polymer phase.

NOSKER T, LYNCH J, KEAR B, HENDRIX J, CHIU G, ZHAO G, HENDRIKS J, NOSKER T J, LYNCHBRANZOI J K, KEAR B H

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J