国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08K003/04（4）
发明人 LI J（2）
公开年
申请年 2021（2） 
专利权人

Preparing carbon-based composite filler useful for thermal interface material, comprises performing surface hydroxylation treatment on carbon films, soaking hydroxylated carbon film in saturated metal salt solution, taking out, drying to obtain metal salt-loaded carbon film, and heating.

ZHOU R

Method for improving heat dissipation of LED, involves respectively utilizing graphene and its derivative graphene oxide as external dopants to increase thermal conductivity of epoxy resin composite material and improves heat dissipation of epoxy resin encapsulated LED.

LI J, YI X, CUI K, DING H, XIE H

Graphene ball conductive adhesive preparation by preparing polymer microsphere using monomer mixture, performing chemical vapor deposition to grow graphene on microsphere surface, and dispersing graphene ball into epoxy resin glue system.

CHEN Y, LI J, LI Y, ZHANG X, LEE Y

Resin composition for treating surface of steel sheet, comprises binder resin, graphene and solvent.

CHO J D, LEE J R, LEE J S, SHIM S E, LEE J, CHO J, SHIM S