国家/地区 中国（6）
IPC部 B（6）
IPC大类 C08（6） B32（4）
IPC小类 C08K（6）
IPC C08L063/02（6）
发明人
公开年 2022（6）
申请年 2022（4）  2021（2） 
专利权人

Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, comprises epoxy resin insulating layer containing white graphene material.

CHEN M, LIU J, JIANG J

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Continuous carbon fiber reinforced thermosetting resin prepreg for three-dimensional printing, has carbon fiber bundles, thermoplastic rubber and thermosetting resin arranged, and carbon fiber bundle formed by bonding carbon fiber with binder.

HU Q, LI D, ZHANG H

Graphene/SiCnw composite film modified carbon fiber composite material comprises composite preform impregnated with liquid resin and cured to obtain composite material.

ZHOU L, WANG B, ZHANG Y, WANG F

Composite material useful for fiber winding, comprises bisphenol A type epoxy resin, toughening epoxy resin, wetting agent, active diluent, hydrophobic modified nano filler, coupling agent, antifoaming agent, latent curing agent, accelerator and wetting dispersant.

QIU S, DENG H, ZHENG S, HUANG B, LI G, LIN W