国家/地区 中国（64）
IPC部 C（64）
IPC大类 C08（64） C09（13） B32（9）
B29（4） C01（4） H05（3）
C03（2） F16（2） H01（2）
IPC小类 C08L（64）
IPC C08L079/08（64）
发明人 LIU Z（4） WANG W（4） LI M（3）
LIAO B（3） LIU H（3） LIU Y（3）
QIAN X（3） SHI Y（3） WANG Z（3）
ZHANG B（3） ZHANG Z（3） CHEN J（2）
CHEN Z（2） CUI S（2） GUO Y（2）
公开年 2021（39） 2020（20） 2022（5）
申请年 2020（64）
专利权人 ZHUZHOU TIME.（3） NINGBO GRAPH.（2） UNIV NANJING.（2）

Preparing modified graphene/bismaleimide resin involves performing amination of graphene allyl phenol organic matter, thermoplastic resin and bismale imide monomer to polymerization reaction.

LI S, YANG H, ZHAO Z, LIU R

Manufacture of high heat-resistant ultra-low expansion polyimide film for e.g. electronics, microelectronics , optical display or optical communication field, by mixing raw material with solvent, filtering, vacuum defoaming, uniformly coating, and peeling substrate.

QIAN X, LIAO B, ZHANG B

Preparing high temperature resistant polyimide useful for manufacturing flexible display substrate, comprises e.g. carrying out suction filtration and vacuum defoaming of polyamic acid resin solution, casting on casting plate, solidifying into adhesive film.

QIAN X, LIAO B, ZHANG B

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Preparing modified reduced graphene oxide/nano alumina composite material modified polyimide wear-resistant film comprises modifying graphene oxide with silane coupling agent, reacting to obtain reduced graphene oxide and adding reduced graphene oxide/nano-alumina composite material to polyimide.

YANG Y, LIU H, ZHENG H, WANG H

Anti-aging chemical barrel comprises polyethylene, silicone rubber, polyamide imide, polyacrylic acid ester, diisocyanate, graphene, titanic acid ester coupling agent, antioxidant, ultraviolet absorbent, 201 silicone oil and color masterbatch.

ZHANG W

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Preparing graphene/polyimide micro-crystal ball composite material useful for solar water heater, comprises e.g. adding high-purity graphene and heat expansion microsphere foaming agent into soluble polyimide solution, and stirring.

ZHANG J, HU J, MAO H

Preparing polyimide film comprises e.g. adding nano powder and dispersant in aprotic polar solvent under nitrogen atmosphere, ultrasonically dispersing, stirring, allowing to stand, curing, filtering, and blowing nitrogen.

LIU Z, WANG K, SHI Y, LV C, SHI J, ZHANG P, SUN P