国家/地区 中国（8） 韩国（7） 日本（6） 加拿大（4） 欧洲专利局（EPO）（4） 美国（4） 世界知识产权组织（2）
IPC部 C（12）
IPC大类 C08（12）
IPC小类 C08K（12）
IPC C08L101/00（12）
发明人 EMPARUZIA V（4） FARRUGIA V M（4） SIBANTIISWARISLISKA.（4）
SRISKANDAR S E（4） SRISKANDHA S E（4） CLARIDGE R（2）
SEOKYONG L（2）
公开年 2022（12）
申请年 2021（6）  2022（5） 
专利权人 XEROX CORP（4） BIT CHEM CO .（2）

Composition used for three-dimensional printing e.g. additive manufacturing, comprises particles comprising thermoplastic polymer grafted to carbon nanomaterial, and particles have preset aerated density.

FARRUGIA V M, SRISKANDHA S E, CLARIDGE R, SRISKANDAR S E, EMPARUZIA V, SIBANTIISWARISLISKANDA

Method for selective laser sintering for three-dimensional article, involves depositing carbon nanomaterial-graft-polyamide particles with other thermoplastic polymer particles, and exposing to laser to fuse polymer particles and form consolidated component by selective laser sintering.

SRISKANDHA S E, FARRUGIA V M, EMPARUZIA V, SIBANTIISWARISLISKANDA, SRISKANDAR S E

Selective laser sintering process for preparing highly spherical particles, involves depositing carbon nanomaterial-graft-polyurethane particles on nanomaterial surface and exposing nanomaterial grafted polyurethane particles to laser, for fusing polymer particles and forming consolidated body.

SRISKANDHA S E, FARRUGIA V M, CLARIDGE R, EMPARUZIA V, SIBANTIISWARISLISKANDA, EASWARI S, SRISKANDAR S E

Selective laser sintering for forming highly spherical particles, involves depositing carbon nanomaterial graft-polyolefin particles on nanomaterial surface, exposing polyolefin particles to laser, for fusing polymer particles, where particles comprise polyolefin grafted to carbon nanomaterial.

FARRUGIA V M, SRISKANDHA S E, SIBANTIISWARISLISKANDA, EMPARUZIA V, SRISKANDAR S E

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Asphalt seal waterproofing material useful for waterproofing building structures and roofs, comprises e.g. asphalt binder, graphene oxide, glycol oil, propoxylate, light calcium carbonate, thermoplastic elastomer and crumb rubber.

SEOKYONG L

Preparing high thermal conductivity resin useful for PCB plug holes, comprises e.g. introducing thermally conductive filler and low dielectric loss resin into preheating machine, carrying out preheating treatment to it by preheating machine; weighing graphene, and passing into mixing drum.

NIE X

Asphalt seal coating film material for composite waterproofing, contains asphalt binder, graphene oxide, glycol oil, propoxylate, calcium carbonate, thermoplastic elastomer, petroleum resin, synthetic rubber, fumed silica and inorganic filler.

SEOKYONG L

Heat-dissipating material used in electrical devices, comprises resin, and graphene having preset average thickness, and has preset nitrogen to carbon ratio as measured by X-ray photoelectron spectroscopy.

KATO T, TAMAKI E

Graphene dispersion used for forming graphene resin powder for battery, comprises graphene and polymer dispersed in solvent, and has preset viscosity measured using B-type viscometer at preset rotating speed.

KUME A