国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7） B29（4） C09（4）
B33（3） H01（2） H05（2）
IPC小类 C08K（7）
IPC C08K003/04（7）
发明人 EMPARUZIA V（3） FARRUGIA V M（3） SIBANTIISWARISLISKA.（3）
SRISKANDAR S E（3） SRISKANDHA S E（3）
公开年 2022（4） 2021（3）
申请年 2021（7）
专利权人 XEROX CORP（3）

Method for selective laser sintering for three-dimensional article, involves depositing carbon nanomaterial-graft-polyamide particles with other thermoplastic polymer particles, and exposing to laser to fuse polymer particles and form consolidated component by selective laser sintering.

SRISKANDHA S E, FARRUGIA V M, EMPARUZIA V, SIBANTIISWARISLISKANDA, SRISKANDAR S E

Selective laser sintering process for preparing highly spherical particles, involves depositing carbon nanomaterial-graft-polyurethane particles on nanomaterial surface and exposing nanomaterial grafted polyurethane particles to laser, for fusing polymer particles and forming consolidated body.

SRISKANDHA S E, FARRUGIA V M, CLARIDGE R, EMPARUZIA V, SIBANTIISWARISLISKANDA, EASWARI S, SRISKANDAR S E

Selective laser sintering for forming highly spherical particles, involves depositing carbon nanomaterial graft-polyolefin particles on nanomaterial surface, exposing polyolefin particles to laser, for fusing polymer particles, where particles comprise polyolefin grafted to carbon nanomaterial.

FARRUGIA V M, SRISKANDHA S E, SIBANTIISWARISLISKANDA, EMPARUZIA V, SRISKANDAR S E

Antiviral material for destroying viruses, including coronaviruses and decreasing risks of viral infection, comprises polymeric matrix and graphene particles dispersed in polymeric matrix.

REDDY M M, FARRAR G J

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R