国家/地区 中国（5） 世界知识产权组织（3） 日本（2） 美国（2）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C09K005/14（5）
发明人
公开年 2021（5）
申请年 2020（3） 
专利权人

Method for improving heat dissipation of LED, involves respectively utilizing graphene and its derivative graphene oxide as external dopants to increase thermal conductivity of epoxy resin composite material and improves heat dissipation of epoxy resin encapsulated LED.

LI J, YI X, CUI K, DING H, XIE H

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N

Silica gel composite material comprises magnetic and heat-conducting wave-absorbing material formed by oriented arrangement of magnetic boron nitride nanosheets, thermally conductive powder, and MXene nanosheets as raw materials.

CAO Y, YANG S, XIE Y, CHEN Y, FANG X, CHEN K