国家/地区 日本（4）
IPC部 C（4）
IPC大类 C08（4） C09（4） H01（2）
H05（2）
IPC小类 C08K（4）
IPC C09K005/14（4）
发明人
公开年 2021（4）
申请年 2020（2） 
专利权人

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A

Heat conductive composition used for e.g. thermal radiation and aerospace material of electric system of motor vehicle, comprises polymer component(s) having different relative permittivity, heat conductive metal filler which is unevenly distributed in one polymer component, and graphene.

MIYATA Y, TAKADA J

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B