国家/地区 中国（6）
IPC部 B（6）
IPC大类 C08（6） B32（4）
IPC小类 C08K（6）
IPC C08K003/04（5） C08K007/00（3） B32B015/20（2）
B32B027/18（2） B32B027/20（2） B32B027/42（2）
B32B037/06（2） B32B037/10（2） B32B038/00（2）
C08K003/22（2） C08K007/18（2） C08K007/24（2）
C08L083/04（2）
发明人 ZHANG C（6）
公开年 2021（6）
申请年 2020（3）  2021（3） 
专利权人

Epoxy-type copper-clad plate material useful for aluminum substrate, and copper clad laminate, comprises composite resin, accelerator, curing agent and tin dioxide/graphene.

ZHANG C

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Preparing modified graphene fluoroplastic heat exchanger, involves preparing modified graphene fluoroplastic raw materials, fins, seals with graphene coatings required for manufacture of heat exchangers, molding, spraying, drying, packaging.

ZHANG Y, ZHANG C

Processing graphene phenolic polymer composite air duct sheet involves using phenolic resin, curing agent, foaming agent and graphene water agent.

ZHANG C, WANG Y

Preparing hybrid double-coated boron nitride/graphene insulating and thermally conductive silicone grease, by adding boron nitride to solvent, adding alcohol, organic solvent and graphene, distilling and mixing with organosilicone.

ZHANG C, RAN W, LI Z

Preparation of thermal interface materials involves immersing graphite powder in acidic aqueous solution, grafting, mixing with e.g. thermosetting resin, applying on release film, peeling, pressing, cutting, and curing.

ZENG X, SUN R, XU J, DENG F, XIN P, REN L, ZHANG C, YE Z