国家/地区 日本（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C09D163/00（4）
发明人
公开年
申请年
专利权人

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Insulating composition for manufacturing substrate such as printed circuit board comprises graphene oxide and insulating material comprising graphene oxide; and polar solvent having specific solvent polarity index.

JI S Y, SEO S H, HAM S J, KIM S H, SOO Y J, SHANG H S, SUK J H, SEUNG H K

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S