国家/地区 欧洲专利局（EPO）（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC H05K009/00（4）
发明人
公开年 2021（3）
申请年 2020（2） 
专利权人

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Coating composition used for a coated substrate comprises a polymer material comprising an electrically conductive polymer, and a coated or partially coated magnetic material comprising a magnetic material and antioxidant material.

KINLEN P J

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q