国家/地区 中国（44） 世界知识产权组织（11） 韩国（8） 美国（8） 台湾（7） 英国（4） 日本（4） 加拿大（3） 香港（3） 澳大利亚（2） 欧洲专利局（EPO）（2） 西班牙（2） 以色列（2） 印度（2） 墨西哥（2） 马来西亚（2） 波兰（2） 新加坡（2） 越南（2） 南非（2）
IPC部 C（57）
IPC大类 C09（57）
IPC小类 C09D（57）
IPC C09D011/03（57）
发明人 LIU Q（6） LI L（5） LI Z（5）
MA Y（5） WANG J（4） WU L（4）
YE D（4） ZENG C（4） CAO D（3）
HASEGAWA S（3） HUANG J（3） KAMIYA N（3）
LI M（3） LI Y（3） PAN Z（3）
公开年 2021（15） 2022（13） 2020（9） 2023（5） 2017（4） 2018（4） 2015（3） 2016（2） 2019（2）
申请年 2020（20）  2021（13）  2022（7）  2017（6）  2018（4）  2015（2）  2016（2） 
专利权人 GUANGDONG KO.（4） GRAPHENE PLA.（3） ALPHA ASSEMB.（2） ANHUI AEROSP.（2）
GRAPHENE PLA.（2） GUANGDONG GA.（2） GUANGXI GANI.（2） HUNAN SINCE .（2）
QINGYUAN JIA.（2）

Conductive ink composition useful in transparent conductive film, comprises 2,4-toluene diisocyanate, polyethylene glycol, epoxy resin, conductive carbon black, conductive graphite, curing agent, solvent, and dispersant, where epoxy resin is bisphenol-A-type epoxy resin epoxy resin.

WANG D

Manufacturing conductive ink useful in circuit board for next generation electronic device comprises e.g. mixing guar gum, xanthan gum, or hydroxyethyl cellulose with heated solvent, and mixing ethylene glycol, or propylene glycol.

HYOYOUNG M

Heating pad in heatable garment, comprises graphene particles dispersed in polymer matrix material, and electrically insulating covering layer bonded to heating pad and electrically insulating covering layer, overlaying and bonded to heating pad.

JONES E O, HOWE T H, SEYMOUR J

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Manufacturing flexible circuit board with electric heating patch comprises e.g. taking flexible single-sided copper clad laminate, manufacturing circuit pattern, manufacturing first solder resist ink composite graphene resin layer on positive-negative combination circuit, pre-baking, and cutting.

LEI H, ZHANG S, GE W, OU D, WU T, QIN J, PENG G, WANG W, WANG M

Preparing conductive ink comprises preparing oligomer containing cholesterol monomer, and taking oligomer as dispersant, adding carbon-based material into non-polar solvent, ultrasonically dispersing and concentrating.

ZHOU M, PAN Z, LI L

Manufacturing plastic card with graphene-antenna comprises preparing colloidal solution including graphene and preparing graphene ink component by mixing colloidal solution, water-dispersible polyurethane solution, and crosslinking agent.

PARK H R

Preparing graphene electrothermal film comprises e.g. coating adhesive on surface of release layer away from graphene conductive layer exposed after peeling off base material to form second adhesive layer, bonding second fiber fabric to second adhesive layer and performing to hot pressing operation.

ZHOU M, PAN Z, LI L

Insulating ink useful e.g. for packaging semiconductor passive element and voltage division comprises e.g. polyurethane resin, phenolic resin, epoxy resin, additives, solvent, carbon material composite, carbon material composite, and zero-dimensional fullerene carbon material.

ZHAO J, XIANG W, ZHANG B, ZHANG Y, HUANG S, GAO J

Manufacturing method of transparent flexible film electrode, by coating surface of the substrate with polyimide, obtaining heat-conductive protective layer, coating UV curing liquid on surface of coating polyimide after obtaining electrode pattern and curing to obtain transparent packaging layer.

PENG L, ZHAN S, ZENG X, JIN S