国家/地区 世界知识产权组织（6）
IPC部 C（6） H（2）
IPC大类 C08（6） C09（6） H01（2）
H05（2）
IPC小类 C08K（6）
IPC C08K003/08（6）
发明人 REN L（2） SUN R（2） XU J（2）
YE Z（2） ZENG X（2） ZHANG C（2）
ZHANG Y（2）
公开年 2021（3）
申请年 2020（3） 
专利权人 SHENZHEN INS.（2）

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Nanohybrid flame retardant composition useful as flame retardant additives for enhanced fire resistance, comprises metallic nanoparticles composition containing e.g. copper, zinc, silver, gold and antimony, and flame retardant material.

KALITA P, JIANG W

Heat dissipation composition used for forming coating agent, comprises base polymer containing silicone-based resin and filler containing at least two of expanded graphite, carbon nanotubes, graphene and metal nanoparticles.

HWANG I S, PARK Y S, HWANG I C, PARK K H, HWANGINSEONG, CHAN H, PARK K

Preparation of graphite oriented thermal interface material involves mixing raw material components of graphite oriented thermal interface material, orienting, freezing, cutting, performing high temperature curing treatment and cutting.

ZENG X, ZHANG C, YE Z, REN L, ZHANG Y, XU J, SUN R, ZHAGN Y

Modifying graphite powder useful for preparing polyolefin-based graphite orientation-type thermal interface material, comprises e.g. performing plasma etching pretreatment on graphite powder, and subjecting to hydroxylation treatment.

ZENG X, ZHANG C, YE Z, REN L, ZHANG Y, XU J, SUN R

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q