国家/地区 中国（5）
IPC部 C（5）
IPC大类 C21（5）
IPC小类 C21D（5）
IPC C21D001/26（5）
发明人
公开年 2021（5）
申请年 2021（5） 
专利权人

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Preparation of graphene copper wire includes ball milling graphene oxide powder and oxygen-free copper powder to obtain mixed powder, hot-press sintering mixed powder, mixing with oxygen-free copper powder to obtain graphene copper sintered body, annealing graphene copper wire and winding.

YANG Z

Preparation of copper based iron based composite electrical contact material includes preparing graphene fiber containing ferric oxide powder, modifying graphene fiber containing ferric oxide powder and pretreating base material.

ZHENG Y

Preparing graphene high-temperature heating aluminum plate comprises e.g. preparing graphene ink, printing graphene ink on the substrate aluminum plate, performing annealing and encapsulating the graphene surface using insulating material.

WANG Z, LI T, YIN J

Method for reducing resistivity of single crystal copper wire, involves annealing single crystal copper under non-oxidizing gas and protective gas atmosphere, introducing carbon-containing gas into copper wire, reacting and cooling.

NOVOSELOV K