国家/地区 中国（4） 韩国（3） 美国（2）
IPC部 C（7） B（3） H（2）
IPC大类 C25（7） C09（2） C23（2）
IPC小类 C25D（7）
IPC C25D007/00（7）
发明人 GUO C（2） LAI H（2） PENG C（2）
公开年 2023（7）
申请年 2022（7）
专利权人 GUANGZHOU UL.（2）

Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.

JING W, LI B, LI R, LI F, WU Q, PAN G

Electrochemical aptasensor for analyzing target material, comprises working electrode modified with graphene nanoplatelet composite including graphene nanoplatelets, transition metal chalcogen compound and amine-based polymer, gold nanoflowers bound to electrode, and aptamer bound to target material.

LEE K, JUNG H, LEE K Y

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Neodymium-iron-boron plating trivalent black chromium and plating layer structure of graphene, has citrate pre-plating nickel layer that is prepared from inside to outside sequentially of substrate, and graphene sealing layer.

PENG C, LAI H, GUO C, LI X

Neodymium-iron-boron plating black zinc and plating layer structure of graphene, has citrate pre-plating nickel layer that is prepared from inside to outside sequentially of substrate, and trivalent chromium black passivation layer.

LUO X, PENG C, GUO C, LAI H

Discoloration-resistant silver plating structure used for contact terminal, comprises silver plating layer, and coating layer comprising resin, carbon fibers, titanium alkoxide, and conductive filler such as carbon, carbon nanotubes, graphene, and/or graphite.

SEAL P S, PYO H S

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z