国家/地区 中国（6）
IPC部 C（6）
IPC大类 C25（6） H05（6） H01（2）
IPC小类 C25D（6）
IPC C25D005/54（6）
发明人 CAO X（2） LU J（2） MA Y（2）
YE G（2） ZHANG J（2） ZHENG K（2）
公开年 2021（4） 2023（2）
申请年 2021（6）
专利权人 CHINESE ACAD.（2）

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Graphene sheet/carbon black composite black hole liquid useful in printed circuit board, comprises graphene sheet, carbon black, surfactant, aqueous high molecular polymer, potassium hydroxide solution and deionized water.

WANG J, LI Z, CAO L, BAI J, FANG B, HAO L

Preparation of black hole liquid for printed circuit board, involves taking graphite plate, titanium plate or graphite plate, using ultra-pure water or aqueous ammonia as electrolyte, electrolyzing, adding conductive agent and adhesive.

WU Z, XIAO C, MO S, LIN J, SUN Y