国家/地区 美国（4）
IPC部 C（4）
IPC大类 C23（4）
IPC小类 C23C（4）
IPC C25D007/00（4）
发明人
公开年 2021（2）
申请年
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Blade comprises metallic substrate and coating system atop the substrate at the tip and comprises first layer of nickel, abrasive layer, comprises matrix and abrasive is partially embedded in the matrix.

JOOST W J, MAALOUF F S, MARTEL N T

Connector e.g. male connector, comprises electrical contact material containing metal base material and conductive coating layer containing phase made of metal other than gold, and phase made of gold or non-metallic conductive material.

KUBO T, OKADA M, SHIMIZU T, KAWAI H, KAWAI Y

Producing graphene layer from liquid metal matrix on solid metal or ceramic substrate of multilayered plate containing e.g. graphene forming matrix, comprises heating, annealing and supplying acetylene, ethylene and hydrogen and cooling.

MODRZYK W, KULA P, RZEPKOWSKI A, PIETRASIK R, ATRASZKIEWICZ R, DYBOWSKI K