国家/地区 中国（9）
IPC部 B（9）
IPC大类 C25（9） C01（5） B22（3）
H01（3） B21（2） B82（2）
C23（2）
IPC小类 C25D（9）
IPC C25D007/06（9）
发明人 JO T（2） JO T J（2） KIDEOK S（2）
LEE S（2） LEE S H（2） PARK S（2）
SEULKI P（2） SONG K（2） SONG K D（2）
SUNHYOUNG L（2） TAE J J（2）
公开年 2017（3） 2022（3） 2021（2）
申请年 2017（3）  2022（3） 
专利权人 ILJIN MATERI.（2）

Lithium-carbon composite belt, comprises conductive substrate, metal lithium transition layer on at least one side of substrate, and lithium-carbon composite material layer positioned outside metal transition layer.

WANG W, SUN Z, HUAN Q, MU H, CHEN Q, KONG D

Use method of nickel plating on aluminum and aluminum alloy coils, comprises e.g. taking platinum electrode as anode, taking aluminum and aluminum alloy coils as cathode, taking conductive ink as electroplating solution, and then placing in sonicator, heating, sonicating, and electroplating.

CHEN Z

Manufacturing titanium fiber used in e.g. biomedical field, comprises subjecting titanium wire to acid washing, pre-nickel plating, and surface copper plating to obtain copper-plated titanium wire, compounding dried copper-plated titanium wire bundled iron pipe, and spraying modified alumina agent.

OUYANG Q, SHUAI G, WEI S, WU X

Segmented annular wire saw for cutting e.g. crystal silicon, has annular bus, where external surface annular bus is interval with multiple sand plating sections, and chip discharging groove formed between adjacent two sand plating sections.

YOU L, ZHANG Y, GONG Y

Automatic production device for conductive cloth, has bracket and base plate that are fixedly connected, where bracket is located at one side of base plate and bracket is orderly provided with stirring mechanism and drying mechanism.

GUO D, HU X

Processing tinned copper-clad alloy wire involves preparing alloy rod, welding copper and alloy wire to form copper-clad alloy wire blank, carrying out multiple times of small deformation drawing processing, and plating tin layer.

OUYANG Y

Electrolytic copper foil used for producing graphene, has preset ratio of surface roughness of copper foil and surface roughness of copper foil after heat treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K

Electrolytic copper foil used for forming graphene during fabrication of semiconductor component for computer, electronic paper and display, has preset tensile strength before and after subjecting to heat-treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K

Method for manufacturing steel sheet or steel strip for battery case, involves providing nickel-plated steel sheet or strip and applying graphene based coating layer on nickel-plated steel sheet or strip.

SHIVAREDDY S, BOHM S, PATOLE S, THAKUR D B, VAN DER WEIJDE D H, BOEHM S