国家/地区 美国（6）
IPC部 B（6）
IPC大类 C25（6）
IPC小类 C25D（6）
IPC C25D011/02（6）
发明人 VEERASAMY V S（2） WU K（2）
公开年 2021（3）
申请年 2020（2） 
专利权人 GUARDIAN IND.（2） HEWLETTPACKA.（2）

Forming adhesively bonded structure used as building infrastructures, by applying primer compound comprising functionalized nanomaterial dopant to substrate, drying primer compound on substrate, applying adhesive compound over primer layer, contacting adhesive layer with substrate, and curing.

SMITH B A, POTEET S A, PUJAR V V

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Composition useful as catalysts and electrodes, comprises a nanoporous carbon powder comprising nanopores having disposed in it copper metal nanostructures and an elemental copper nanowires.

NAGEL C J, BRODEUR C L, NAZEL C A J, BRODARD C L

Multi-layered sheet for use as housing for electronic devices, has graphene-based barrier coating that includes specified amount of graphene and is formed on micro-arc oxidized layers and has prescribed thickness.

WU K, CHANG C, CHEN W

Method of disposing graphene thin film over target receiving substrate involves hetero-epitaxially growing graphene thin film on catalyst thin film containing a metal and disposing graphene thin film and catalyst thin film.

VEERASAMY V S

Method for isolating graphene thin film involves causing graphene thin film and polymer-based coating to be released from catalyst thin film, after curing polymer-based coating.

VEERASAMY V S, VEERASAMY V