国家/地区 中国（2） 美国（2）
IPC部 C（4）
IPC大类 C25（4） H05（4）
IPC小类 C25D（4）
IPC H05K003/00（4）
发明人 YANG N（2） YEH A（2）
公开年
申请年
专利权人 TRIALLIAN CO.（2） YEH A（2）

Preparing low transmission loss single crystal copper material comprises e.g. forming single crystal copper layer on substrate i.e. graphene layer surface, and peeling off single crystal copper layer from substrate in mixed gas atmosphere of argon and hydrogen.

WANG E, YUE X, HUANG Z, HE M, ZHANG Z, DING Z

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Method for modifying walls and bottoms of holes with reduced graphene oxide, involves providing substrate with copper cladding layer and drilled holes, while modifying walls and bottoms of holes with reduced graphene oxide.

YEH A, YANG N, YEH D, YANG F