国家/地区 中国（18）
IPC部 C（18）
IPC大类 C23（18）
IPC小类 C25D（18）
IPC C23C016/26（5） C25D003/38（4） C25D003/56（4）
C25D009/04（4） C23C028/00（3） C25D003/12（3）
C25D005/34（3） C25D005/48（3） C25D015/00（3）
C23C018/34（2） C23C018/40（2） C23F015/00（2）
C23G001/10（2） C25D013/20（2）
发明人 CHEN Y（3） LI X（3） WANG X（3）
GUO C（2） HE P（2） LAI H（2）
LI A（2） LIU Y（2） YANG D（2）
ZHANG Z（2）
公开年 2019（9） 2020（9）
申请年 2019（18）
专利权人 CHINA DONGFA.（2） GUANGZHOU UL.（2） UNIV BINZHOU（2） UNIV SICHUAN.（2）

Preparing graphene-based superhydrophobic B30 copper-nickel alloy involves polishing B30 copper-nickel alloy with sandpaper to remove impurities and oxides on the surface, using absolute ethanol and ultrasonic cleaning.

LIU Y, CHEN Y

Preparing graphene-based superhydrophobic magnesium alloy comprises polishing magnesium alloy, ultrasonically cleaning using isopropanol and acetone, drying using nitrogen and performing electro-deposition using electrolyte composition.

CHEN Y

Vacuum brazing dispersed copper involves cleaning surface of dispersed copper workpiece, drying, blasting using graphene composite particles, placing in rare gas atmosphere, irradiating, cooling, electroplating, and vacuum brazing.

YANG P, CHEN M, HOU R, WANG X

Cyanide-free cadmium-titanium alloy and graphene closed plating layer structure for aerospace fastener, comprises metal substrate, non-cyanide cadmium-titanium alloy plating layer, chromate low chrome color passivation layer and nano hydroxyl graphene closed layer.

GUO C, LAI H

Preparing low-temperature hydrophobic heat exchange material based on stainless steel and graphene comprises e. g. plating copper or nickel on surface of stainless steel and performing chemical plating or electroplating.

ZHANG Z, YANG D, HE P

Sealant for nickel-plated metal component, comprises graphene, graphene dispersant, two types of silica sol, water-soluble polymer resin emulsion, silane coupling agent, and water.

DOU H, ZHANG C, LI A

Nano-alumina pore and graphene multilayer wave-absorbing device comprises wave absorbing device and graphene and metal substrate, where nano-alumina holes are arranged in hexagonal shape.

KUANG D, YANG Z, LI W

Preparing stainless steel composite material for condensation heat exchange, involves plating copper or nickel on the surface of stainless steel, using electroless plating or electroplating, preparing graphene hydrophobic coating.

ZHANG Z, YANG D, HE P

Preparing copper or graphene-plated magnesium alloy composite material involves insulating aluminum and zinc, smelting aluminum after heat preservation is completed, and adding zinc to aluminum melt and mixing, and melting zinc.

ZHOU L, LI X, WANG X, YI J, ZHANG X, ZHOU X

Graphene-containing PCB copper composite plating solution includes a copper ion source, where the copper ion source is preferably copper chloride, copper sulfate, the content of the copper ion source is 55-95g/L, sulfuric acid is preferred.

LI A