国家/地区 中国（5）
IPC部 B（5）
IPC大类 C23（5）
IPC小类 C23C（5）
IPC B82Y030/00（2） C23C014/18（2） C23C016/26（2）
发明人
公开年 2021（5）
申请年 2021（5）
专利权人

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Coating structure for aging-resistant zinc-nickel alloy silane-free passivation, comprises aluminum alloy substrate, and chemical deposition zinc layer, chemical nickel plating layer, and silane chromium free passivation layer.

CHEN J, GUO C, LAI H

Preparing ultra-thin radiating fin used in electronic device, and integrated circuit , involves preparing metal radiating sheet with array pattern on surface of metal foil by nanometre stamping template, and depositing vertical graphene film array on surface.

PAN Z, TAN H

High performance silicon-based lithium ion battery cathode material has core prepared by obtaining silicon-based particle/transition metal composite material, and adding carbon source.

ZHAO H, YANG C, LI Z

Preparing anode foil by heating and treating corroded foil, using forming solution for perform forming of corroded foil, coating graphene solution on surface of forming foil, sintering and performing phosphating treatment on forming foil.

LIU G, HUANG H, WU Q, HUO J, OU K, CHEN Y, FENG Z, YANG F