国家/地区 中国（6）
IPC部 C（6）
IPC大类 C25（6） C23（4） G21（2）
IPC小类 C25D（6）
IPC C25D005/48（2）
发明人 ZHANG J（6）
公开年 2022（6）
申请年 2021（5） 
专利权人 CHINA NUCLEA.（2）

Preparing corrosion resistant coating electrode used for circulating external drainage and desalting comprises polishing and deionized water titanium base plate into acid solution, etching, using cathode and anode salt solution as electrolyte, coating graphene dispersion liquid, and drying.

ZHANG J, MIAO Y, YAN Z, MENG Z, FAN L, LI Y, SONG C, XIU C, ZHANG Q, WU X, XIE X, WANG X

Preparation of graphene heat conducting sheet for e.g. reinforcing longitudinal heat flux transmission, involves spraying graphene oxide quantum dots on inner edge surface of prepared annular graphene oxide film, placing in humidity box, compacting and molding, and graphitizing.

KONG X, JIAO Y, ZHANG J, ZHANG Z

Preparing composite film used in membrane water treatment e.g. microfiltration, involves providing graphene oxide doped electrolyte solution, immersing electropolymerized base film and applying positive potential to base film to initiate electropolymerization reaction.

ZHANG J, LIANG S

Preparation of graphene-encapsulated ultra-thin nickel-63 radiation source film used in preparation of Schottky junction stacked radiation cell, involves preparing nickel chloride film, and putting graphene/nickel chloride/graphene film in vacuum environment for reduction treatment.

WANG X, WANG L, CHEN Z, YANG Y, ZHANG J, SU C, FENG H, LI P, WU W, LUO T, ZHOU C

Preparation of ultrathin beta-radiation source for micro-components, involves using polymethyl methacrylate/graphene film and platinum sheet, and depositing beta-radiation source on graphene using solution of e.g. beta-radiation source.

ZHANG J, LI C, WANG X, XU P, FENG H, CHEN Z, YANG Y, WU W, ZHOU C, LUO T

Preparing surface metal layer used in aerospace, electrical and electronic fields, involves e.g. coarsening, sensitizing and activating polyetheretherketone modified with carbon fiber, glass fiber, carbon nanotube and graphene, chemical plating and electroplating copper, and plating nickel.

ZHANG L, TONG X, WANG J, ZHANG J, WEN C, LI S, CUI Q, WANG X, XU J, FENG L, BAI J, LI J, WANG N