国家/地区 中国（10）
IPC部 C（10）
IPC大类 C25（10） C23（3） B01（2）
IPC小类 C25D（10）
IPC C25D003/38（10）
发明人 CHEN M（3） GUO C（3） LAI H（3）
WANG Q（3） HE P（2） LIU S（2）
YANG D（2） ZHANG Z（2）
公开年 2020（10）
申请年 2019（8）  2020（2） 
专利权人 GUANGZHOU UL.（3） CHINA DONGFA.（2） GUANGZHOU KA.（2）

Plating layer structure for sealing red copper and nano graphene, comprises metal substrate, cyanide pre-plating copper layer, middle copper plating layer, bright copper plating layer, gun black tin nickel alloy plating layer and graphene sealing layer.

GUO C, CHEN M, LAI H

Filter membrane prepared by co-growing graphene by copper plating on copper mesh, useful in filter for purification equipment, comprises copper mesh, modified graphene solution, electroless copper plating solution and acid-base regulator.

WANG Q, LIU S

Bronze and nano graphene plating layer structure comprises metal substrate, cyanide pre-plating copper layer, middle copper plating layer, bright copper plating layer, bronze plating layer, black tin nickel alloy plating layer and graphene sealing layer.

GUO C, CHEN M, LAI H

Plating layer structure for rolling plating antique copper comprises metal substrate, copper plating layer, antique copper coloring layer and graphene sealing layer orderly prepared from inside to outside on metal substrate.

GUO C, CHEN M, LAI H

Preparing graphene composite copper filter membrane involves forming water-soluble modified graphene solution with concentration gradient, preparing copper electroplating solution, adding water-soluble modified graphene solution.

WANG Q, LIU S

Preparing low-temperature hydrophobic heat exchange material based on stainless steel and graphene comprises e. g. plating copper or nickel on surface of stainless steel and performing chemical plating or electroplating.

ZHANG Z, YANG D, HE P

Preparing stainless steel composite material for condensation heat exchange, involves plating copper or nickel on the surface of stainless steel, using electroless plating or electroplating, preparing graphene hydrophobic coating.

ZHANG Z, YANG D, HE P

Through-hole plating method for printed circuit boards, involves grafting graphene oxide with gamma-aminoethylaminopropyltrimethoxysilane to give product, adsorbing product of active metal ions, and electroplating.

CHEN Y, WANG Y, LI Q, HE W, WANG C, WANG S, ZHOU G, WANG Q, AI K, HU Z

Preparing copper or graphene-plated magnesium alloy composite material involves insulating aluminum and zinc, smelting aluminum after heat preservation is completed, and adding zinc to aluminum melt and mixing, and melting zinc.

ZHOU L, LI X, WANG X, YI J, ZHANG X, ZHOU X

Preparation method of copper-coated graphene comprises mixing modified graphene slurry, soluble copper salt, sulfuric acid, chlorine ion additive, copper gloss additive and water to obtain plating liquid, plating, filtering, and passivating.

CHEN W, CAI M, LI J