国家/地区 中国（5）
IPC部 C（5） B（3）
IPC大类 C25（5）
IPC小类 C25D（5）
IPC C25D005/18（5）
发明人
公开年 2021（3）
申请年 2021（5）
专利权人

Preparing graphene reinforced metal/alloy composite material, involves orienting solution containing graphene and metal ions, keeping spreading state of graphene unchanged, and co-depositing graphene and metal or alloy on cathode plate.

HUANG Y, LANG H, PENG Y

Mercaptobenzene functionalized graphene/copper composite thermal conductive coating for electronic and biological applications, comprises graphene functionalized by mercaptobenzene and chemically connected with nano-copper through mercaptobenzene molecular junction.

ZHENG Q, LI X

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z

Preparing magnesium alloy conductive coating used in military electronic equipment, involves cutting magnesium alloy block, stir friction processing on magnesium alloy pre-treated surface and preparing electrochemical coating containing polyaniline and graphene on magnesium alloy surface.

YU Z, ZHANG X, ZHENG Y

Preparing double-pulse electroplating nickel-graphene composite plating layer of continuous casting crystallizer comprises processing crystallizer copper plate before electroplating, and preparing graphene oxide solution by Hummers method.

FENG T