国家/地区 中国（6）
IPC部 C（6） B（2） H（2）
IPC大类 C25（6） B05（2） H05（2）
IPC小类 C25D（6）
IPC C25D007/00（6）
发明人 CAO X（2） GUO C（2） LAI H（2）
LU J（2） MA Y（2） PENG C（2）
YE G（2） ZHANG J（2） ZHENG K（2）
公开年 2023（6）
申请年 2022（4）  2021（2） 
专利权人 CHINESE ACAD.（2） GUANGZHOU UL.（2）

Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.

JING W, LI B, LI R, LI F, WU Q, PAN G

Neodymium-iron-boron plating trivalent black chromium and plating layer structure of graphene, has citrate pre-plating nickel layer that is prepared from inside to outside sequentially of substrate, and graphene sealing layer.

PENG C, LAI H, GUO C, LI X

Neodymium-iron-boron plating black zinc and plating layer structure of graphene, has citrate pre-plating nickel layer that is prepared from inside to outside sequentially of substrate, and trivalent chromium black passivation layer.

LUO X, PENG C, GUO C, LAI H

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z