国家/地区 韩国（4）
IPC部 F（4）
IPC大类 F28（4） H05（3） H01（2）
IPC小类 F28D（4）
IPC F28D015/02（4）
发明人
公开年 2021（2）
申请年 2021（2） 
专利权人

Vapor chamber for use in e.g. electronic device, has sealing parts formed along edges of opposite surfaces of upper and lower plates, and porous metal fiber sheet provided between upper plate and lower plate and filled with low boiling point fluorohydrocarbon.

HUN L S, KIMTAEHAN

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Method for manufacturing diamond-graphene hybrid thermal management material, involves converting predetermined thickness of partial area of one side or both sides of diamond base material into vertical graphene, where diamond base material serves as heat spreader.

JU H, LEE J K, SU J

Multi-channel parallel heat pipe used for air-cooled cooling system, comprises heat pipe having micro diameter and graphene nanofluid as working fluid.

BAEKSEUNGYEOP, JEONG H M, JEONG L A, KIM S D, HAN C H, SEUNGHYOUN L