国家/地区 中国（2） 台湾（2） 美国（2）
IPC部 F（4）
IPC大类 F28（4）
IPC小类 F28D（4）
IPC G06F001/20（4） H05K007/20（4） F28D015/02（2）
H01L023/427（2）
发明人
公开年 2021（3）
申请年 2020（4）
专利权人

Thermal management device for electronic device, has bracket that is provided with clamping portion that holds heat pipe by side exterior surfaces of heat pipe, and that does not extend past first exterior surface of pipe.

HUANG H, WU K, CHANG C H

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Heat conduction structure used in mobile device, has two heat conduction layers and metal microstructure that form stacked structure and stacked structure that is divided into two sections in direction along axis of heat conducting unit.

XIAO Y, HE M, SHIAU Y