国家/地区 中国（3） 美国（3） 欧洲专利局（EPO）（2） 世界知识产权组织（2）
IPC部 F（6）
IPC大类 F28（6）
IPC小类 F28D（6）
IPC H01L023/427（4） H05K007/20（4） G06F001/20（3）
F28D015/02（2）
发明人
公开年 2021（5）
申请年 2020（6）
专利权人

Thermal management device for electronic device, has bracket that is provided with clamping portion that holds heat pipe by side exterior surfaces of heat pipe, and that does not extend past first exterior surface of pipe.

HUANG H, WU K, CHANG C H

Heat sink for use with photovoltaic solar panel unit, comprises fins spaced apart from each other and having predetermined length, thickness and height.

MCCLOSKEY D

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Graphene vinyl chloride soaking plate, has capillary core layer formed between upper layer plate and lower layer plate, where inner portion of lower layer plate is provided with filling chamber.

LI G, ZHANG C

Heat conduction structure used in mobile device, has two heat conduction layers and metal microstructure that form stacked structure and stacked structure that is divided into two sections in direction along axis of heat conducting unit.

XIAO Y, HE M, SHIAU Y

Phase change composite useful in a heat spreader, comprises a structure in which phase change material unit layers and thermal conductive layers are sequentially laminated.

KIM D R, HEU C S, KIM S H, LEE H S, SON H W, KIM D, HO K S, LEEHEUNGSOO