国家/地区 德国（4）
IPC部 H（4） B（3） C（3）
IPC大类 H05（4） B32（3） C01（3）
H01（2）
IPC小类 H05K（4） B32B（3） C01B（3）
H01L（2）
IPC H05K003/46（4） C01B032/182（3） B32B007/12（2）
B32B009/00（2） B32B015/04（2） B32B037/12（2）
H05K001/02（2） H05K001/03（2）
发明人 LEVI A（4）
公开年 2022（4）
申请年 2022（4）
专利权人 MELLANOX TEC.（4） UNIV BARILAN（4） PCB TECHNOLO.（2）

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Method of depositing two-dimensional material onto target substrate, involves removing starting substrate layer from laminate stack after heat and pressure is applied to form target two-dimensional structure.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A