国家/地区 中国（18）
IPC部 B（18）
IPC大类 B32（18）
IPC小类 B32B（18） C08L（16） C08K（15）
C08J（12） C08G（3） H05K（3）
B29C（2） B29D（2）
IPC B32B037/10（18）
发明人 CHEN H（2） CHEN J（2） HE H（2）
JIA L（2）
公开年 2022（18）
申请年 2021（9）  2022（8） 
专利权人 HUIZHOU ZHON.（2）

Preparing conductive sheet used for flow battery bipolar plate, comprises preparing high conductive layer, stacking high conductive layer on intermediate layer, and placing stacked high conductive layer and intermediate layer in hot-pressing environment for hot-pressing.

MA J, ZENG Z, ZHU H

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Carbon fiber reinforced graphene board, comprises curing sheet, heating film, solidifying sheet, shielding film and solidifying sheet, where curing sheet is prepared by mixing nano-cellulose, graphene and deionized water, performing ultrasonic treatment to obtain mixed solution.

JIN Y

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

Producing textured composite board mobile phone cover, comprises mixing epoxy resin, allyl-containing epoxy monomer and curing agent to obtain a glue solution, coating glue on sides of modified glass fiber cloth, curing to form prepreg, placing textured film on upper surface, and hot pressing.

CHEN H, CHEN J, WANG B, HE H, ZHANG Z

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

Graphene multifunctional insole comprises insole main body comprising base pad body, graphene conducting layer and ventilation layer, ventilation hole arranged on ventilation layer, and heat conducting reinforcing block embedded on conducting layer.

FU X

High heat conducting graphene magnetic composite material comprises graphene film layer and substrate layer, where preparation raw material of graphene film layer comprises graphene, composite base material and solvent, and substrate layer comprises soft magnetic material and hard magnetic material.

LIN Y, JIANG X, CHEN F, JIANG W, FANG W

Preparing heat-pressing molding foam absorbing material involves mixing raw materials comprising components, foam type surfactant, wave absorbing agent, catalyst and water to form to-be aggregate raw material, where wave absorbing agent is carbon black, graphite, carbon nano tubes and graphene.

YANG R, ZHAO Z, LIU R

Preparing a electric response shape memory composite material useful in electric drive shape memory polymer material low resistor and high stability, comprises e.g. taking shape memory polymer solution/prepolymer solution, dispersing and forming uniform conductive slurry and coating into groove mold.

LIU Y, ZHANG F, HU R, LENG J