国家/地区 中国（2） 台湾（2） 世界知识产权组织（2）
IPC部 C（6）
IPC大类 C23（6）
IPC小类 C23C（6） C01B（3） G06F（3）
IPC C23C014/06（6）
发明人
公开年 2022（6）
申请年 2021（4）  2022（2） 
专利权人

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Visualizing distribution and intrinsic orientation of periodically spaced one-dimensional structures by depositing electrically conductive solid film of imaging material onto surface of two-dimensional material, providing polarization microscope, and imaging layered composite at acquisition angles.

AMADO E, KRESSLER J

Graphene sensor composite heat protection structure, comprises substrate layer, graphene sensitive layer, nitride isolation layer, alumina protective layer, and high temperature ceramic protective coating, where substrate layer is provided with a graphene sensitive layer.

LI M, ZHANG H, WANG J

Laminate used for electronic device such as display device, comprises substrate, layer containing compound having condensed polycyclic hydrocarbon structure, and layer containing conductive material.

NAOYA N, KAZUNORI T, NOSAKA N, TAKANASHI K

Graphene-coated copper electronic component comprises non-metallic substrate and graphene-copper coating comprising copper body embedded with graphene sheets.

TSAI S T, SHIH Y M, HSU H Y

Preparing flexible strain sensor useful e.g. in carbon dioxide sensor, comprises e.g. preparing thin film insulating layer on flexible substrate, performing annealing process, and forming multilayer graphene between flexible substrate and catalytic metal layer.

WANG X, YU G, WANG G, LUO G, LI J, LI X