国家/地区 中国（4） 韩国（2）
IPC部 C（6） F（6） B（4）
IPC大类 C01（6）
IPC小类 C01B（6）
IPC C01B032/198（3） C01B032/184（2） C01B032/19（2）
F28D015/04（2） F28F003/00（2） F28F021/02（2）
F28F021/08（2）
发明人
公开年 2022（6）
申请年 2020（2）  2021（2）  2022（2） 
专利权人

Carbon steel material useful for heat sink in electrical and electronic devices comprise carbon steel substrate, and reduced graphene oxide coating layer formed on the carbon steel substrate.

DOW H S

Aluminium graphene uniform temperature plate for flat computer internal heat dissipation, has graphene layer arranged between aluminum-based upper plate and aluminum-based lower plate, and cross-linking holes provided with aluminum-based connecting particles.

WANG G, XU X

Oxidation graphene production device for producing graphene oxide, has temperature adjusting medium that enters from heat exchanger box to inside of hollow side wall of reaction kettle through infusion pump on circulating pipeline.

CHEN Y, ZHAO Z, XIA X, LIANG G

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Porous 3D graphene structure used as porous wick medium in thermal systems such as vapor chambers or heat pipes used in electronic devices to enhance thermal performance.

KOSAR A, KAYA I I, SADAGHIANI A K, APAK A, APAK A M, PARLAK M, TASTAN U, BOENCUE M

Method for preparing medium transmission core in heat pipe for use in mobile phone, computer and other electronic products, involves reducing graphene oxide films by performing flame firing process, and performing high temperature thermal reduction process.

SU D, TANG Z, LU J, ZHOU R, ZHOU B