国家/地区 世界知识产权组织（11）
IPC部 C（11）
IPC大类 C09（11） H01（7） C08（6）
H05（5） C01（3） G01（2）
IPC小类 C09D（11）
IPC C09D011/52（7） C08K003/04（5） C09D007/61（3）
C01B032/174（2） C08K003/08（2） C09D005/24（2）
C09D007/45（2） C09D011/037（2） C09D011/102（2）
C09D163/00（2） H01B001/24（2） H05K001/09（2）
H05K009/00（2）
发明人 SYLVESTER K T（2）
公开年 2022（11）
申请年 2021（11）
专利权人 PPG IND OHIO.（2）

Method useful for e.g. depositing nanocomposite in e.g. solar application, involves stabilizing reduced graphene oxide with poly(sodium 4-styrenesulfonate), mixing conductive polymer and poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate) and electropolymerizing obtained solution onto electrode.

WAN SALIM W W A, BENOUDJIT A, SHOHIBUDDIN I U S

Electrodepositable coating composition used e.g. to coat substrate e.g. battery component e.g. battery cell, and battery module, comprises electrodepositable binder, and thermally conductive, electrically insulative filler material.

DEDOMENIC C J, MA L, POLLUM M M, PUODZIUKYNAITE E, DACKO C A, SYLVESTER K T, ZAWACKY S R

Electromagnetic interference shield comprises substrate, metal-based conductive additive, and binder incorporated with metal-based conductive additive and deposited as electromagnetic interference shielding coating on substrate.

ELKADY M F, LANE S, KANER R B, KAVANAUGH J

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Electrolyte composition used for exfoliation of graphite for graphene for conductive ink for 3-dimensional printing and supercapacitor, comprises quaternary ammonium salt, another quaternary ammonium salt, and electrolyte solvent.

LU J, LI J, WANG F

Cooling of semiconductor component for e.g. heat sink, involves arranging metal layer between component and heat dissipation coating layer, forming coating layer by using heat dissipation coating composition containing urethane binder resin, and exfoliating thermally conductive particles.

KIMTAEHAN, HUN L S, CHOI S, SHIM Y, SONG J, KIM T H, LEE S H, CHOI S I, SIM Y H, SONG J H

Dispersion of carbon nanotubes used in slurry composition for forming electrode, comprises organic medium, carbon nanotubes dispersed in organic medium, and dispersant comprising addition polymer comprising constitutional units comprising residue of alkyl ester of (meth)acrylic acid.

HELLRING S D, VOTRUBADRZAL P L, ZHOU Z, SYLVESTER K T, SISCO S W, JO J, OIL C, DENISON G M

Carbogenic nanoparticle-conducting polymer composite ink for thin film coated printed circuit board, dispersed in water, where carbogenic nanoparticle is reduced graphene oxide, and composite ink includes e.g. graphene oxide-polypyrrole composite ink and carbon quantum dots-polyaniline composite ink.

BHATTACHARJEE L, SHARMA A, MANNA U, GOEL A, PAL B, BESSEMER C

Carbon material dispersion liquid used for manufacturing e.g. paints, comprises carbon material containing carbon black, organic solvent, and polymer dispersant comprising amine-containing structural unit, propanone-containing structural unit, and other structural units connected to these units.

HIROYUKI S, YOSHIKAZU M, JUN K, SEIJI D, SHIMANAKA H, MURAKAMI Y, KAMABAYASHI J, DOI S