国家/地区 中国（12）
IPC部 C（13） B（2） H（2）
IPC大类 C09（13） C08（2） H01（2）
IPC小类 C09J（13）
IPC C09J011/04（13）
发明人 CHEN Y（2） WU F（2） ZHANG Z（2）
ZHU J（2）
公开年 2023（13）
申请年 2023（13）
专利权人

High-barrier heat-resistant solvent-free polyurethane composite material useful as film lamination in packaging composite field of e.g. daily chemical, comprises e.g. polyurethane prepolymer, graphene modified polyol, polyester polyol, nano-silicon dioxide modified polyether polyol and isocyanate.

HE C, TIAN L, WEN Y

Sealant used in automobile, comprises silane-terminated polyether polymer, modified graphene, aluminum hydroxide, cage octahydroxy-polysilsesquioxane, dehydrating agent, thixotropic agent, adhesion promoter and catalyst.

CHEN H, ZHU J

Heat-and-humidity resistant high-strength composition used for battery packaging materials, comprises polyether polyol, modified carbon active substance, dispersant, organic coupling agent, solvent, and modified polyisocyanate curing agent formed by oligomerizing hexamethylene diisocyanate.

WANG W, ZHANG J, SUN Y, CHEN Y, WANG Z

Anisotropic conductive adhesive film with high shelf life comprises first solution, second solution and initiator, where first solution includes adhesive, curing agent and free radical polymerization inhibitor, and second solution includes e.g. resin substrate and conductive particles.

WU F, QIAN J, YUAN B, LU C

High thermal conductivity electromagnetic shielding material module used for e.g. chip, comprises heat conduction layer, and heat dissipation layer, where heat conduction layer is polymer heat conduction adhesive film, and heat dissipation layer is copper foil, aluminum foil or graphite sheet.

YAN C, LI W, SUN X, ZHAO Z

Preparation of flame retardant foam by heating and dehydrating part of polyether polyol, adding remaining polyether polyol, polyester polyol and additives to reaction kettle, mixing dehydrated polyether polyol, mixed solution and isocyanate for reacting, adding graphene, foam coating and drying.

FU J, WANG E, SU Y, WANG J, ZHANG Z

Heat-conducting adhesive film useful for electronic module, comprises e.g. epoxy resin, epoxy resin curing agent, film-forming resin, ethylene glycol diglycidyl ether, silicon micropowder, glass powder, nano-dioxide, quartz powder, aluminum nitride, silicon nitride and graphene oxide.

XU J, HUANG Z, QI F, ZOU W, PENG T

Carbon dioxide-based bi-component polyurethane thermal-conducting adhesive comprises isocyanate terminated double ended polyurethane prepolymer, spherical alumina as thermally conductive filler, polyether polyol, polybutadiene polyol and small molecule polyol.

CAO Y, LIU T, LIN H, ZHANG X

Antistatic conductive adhesive for circuit board, comprises nano-silver/functionalized graphene hybrid conductive filler, siloxane resin, catalyst, reinforcing agent, inhibitor and crosslinking agent, where siloxane resin is composed of vinyl silicone oil and vinyl MQ silicon resin.

ZHOU F, ZHU J, PAN Y, CHEN Y

Two-component silicone potting adhesive in a power battery forming room temperature vulcanizing double component organic silicon sealing glue, comprises POSS modified polysiloxane, and thermal conductive filler as component A, and POSS modified polysiloxane, platinum catalyst as component B.

DU H, YU X, MENG L, ZHANG Z, GUO X